Carbon Nano Tube Pellets Used For Black Master Batch

Product Description: Carbon Nanotube-Based ESD Protective Packaging Solutions

As a foreign trade manager specializing in advanced semiconductor packaging materials,

I am pleased to introduce our groundbreaking Carbon Nanotube (CNT) Composite ESD Protection Series,

designed to revolutionize cleanroom compatibility and electrostatic discharge (ESD) safety for high-precision

semiconductor applications.

Below, we highlight three key advantages of our CNT-enhanced solutions:

1. Superior Conductivity for Unmatched ESD Protection
   Our proprietary CNT formulation delivers 1,000x higher electrical conductivity compared to traditional carbon black-filled polymers, ensuring instantaneous static dissipation (<1 second) while maintaining surface resistance within the critical 10⁶–10⁹ Ω/sq range. Unlike conventional materials that rely on uneven carbon black dispersion, our vertically aligned CNT networks create a homogeneous conductive matrix, eliminating "hot spots" and ensuring consistent ESD performance across IC trays, wafer ships, and turnover boxes. This enables safe handling of ultra-sensitive devices like 3nm/2nm chips and GaN/SiC wafers.

2. Zero Particle Shedding for ISO Class 1 Cleanroom Compliance
   The covalent bonding structure of our CNTs prevents submicron particle release (<0.1µm), achieving <10 particles/ft³ contamination under ASTM F312-16 testing – 50x cleaner than industry standards. Traditional carbon-based materials often suffer from filler migration, but our patented cross-linking process permanently anchors CNTs within the polymer matrix. This makes our products ideal for wafer boxes and carrier reels used in EUV lithography cleanrooms, where even a single 0.3µm particle can cause yield loss.

3. Dimensional Stability in Extreme Manufacturing Environments
   The CNTs' graphitic structure provides 300% higher thermal conductivity (45 W/m·K) and 200% better dimensional stability versus standard ESD plastics. Our IC trays maintain ±0.02mm tolerance through 200°C reflow cycles, while wafer ships resist warpage under vacuum packaging. The material's hydrophobic surface (contact angle >120°) also prevents moisture absorption, ensuring compatibility with H2O-sensitive GaAs/InP devices.

Target Applications:

• IC Trays: CNT-embedded pockets prevent ESD damage during pick-and-place operations
• Wafer Ships: Multi-layer CNT shielding blocks >99.99% of external EMI (20Hz-10GHz)
• Turnover Boxes: Antistatic surface maintains <100V charge even in dry (<10% RH) environments

Certifications: SEMI F47-0706, MIL-STD-1686C, RoHS/REACH compliance.

Our CNT solutions are already deployed in TSMC's N5/N3 fab lines and Intel's 7nm packaging facilities. Let us customize a particle-free ESD packaging system for your next-gen semiconductor needs.